Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Engineering
364
Scholar Citations
9
Scholar h-index
9
Scholar i10-index
RECENT SCHOLAR PUBLICATIONS
Efficient Realization of Audio Processing on FPGA M Holy, R Chauhan, Y Agrawal, P Kumar, MG Kumar, R Chandel 2025 5th International Conference on Artificial Intelligence and Signal … , 2025 2025
Novel Electrical Analytical Model of Serpentine Stretchable Interconnect under Mechanical Effects G Bhatti, Y Agrawal, V Palaparthy, MG Kumar, R Sharma IEEE Transactions on Components, Packaging and Manufacturing Technology , 2025 2025
Mechanical and electrical testing of encapsulated stretchable substrate interconnect models for emerging flexible electronic systems G Bhatti, Y Agrawal, V Palaparthy, R Sharma, MG Kumar Microelectronics Reliability 172, 115824 , 2025 2025 Citations: 1
Explicit Analytical Model of Stretchable Interconnects for Flexible Electronics System G Bhatti, Y Agrawal, V Palaparthy, MG Kumar, R Sharma IEEE Transactions on Signal and Power Integrity , 2025 2025
Reliability Assessment Using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System G Bhatti, Y Agrawal, V Palaparthy, R Sharma, MG Kumar IEEE Transactions on Components, Packaging and Manufacturing Technology , 2025 2025 Citations: 2
High Frequency Analysis of Cu-CNT Based Tapered TSV Bumps MG Kumar, Y Agrawal, R Sharma 2025 IEEE 29th Workshop on Signal and Power Integrity (SPI), 1-4 , 2025 2025 Citations: 1
Essential Frequency Analysis for stacked Cu-CNT composite cells of TSVs MG Kumar, Y Agrawal, H Pulluri, R Sharma IEEE Access 13, 41221-41229 , 2025 2025 Citations: 1
Neural network-based fast and intelligent signal integrity assessment model for emerging MWCNT bundle on-chip interconnects in integrated circuit G Bhatti, T Pathade, Y Agrawal, V Palaparthy, B Gohel, R Parekh, ... IETE Journal of Research 70 (3), 2878-2893 , 2024 2024 Citations: 5
Pushpanjali; Subbarao, AVM; Singh, VK; Srivastava, A. Generalization Ability of Bagging and Boosting Type Deep Learning Models in Evapotranspiration Estimation. Water 2024, 16 … M Kumar, Y Agrawal, S Adamala 2024 Citations: 3
Design of Efficient RAM Cell using Quantum-Dot Cellular Automata VR Kumar, GP Kumar, M Girish, BD Madhuri 2024 International Conference on Computer, Electronics, Electrical … , 2024 2024 Citations: 1
Explicit Power-Delay Models for On-Chip Copper and SWCNT Bundle Interconnects Y Agrawal, V Palaparthy, MG Kumar, K Mummaneni, R Chandel Interconnect Technologies for Integrated Circuits and Flexible Electronics … , 2023 2023
Modelling of reference evapotranspiration using neural network and regression approaches for semi-humid region of Sikkim GT Patle, BP Mandal, M Kumar, D Jhajharia Journal of Agricultural Engineering 60 (2), 205-217 , 2023 2023 Citations: 6
Signal Integrity Assessment of GNRFET-Based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion MG Kumar, M Rajeswari, Y Agrawal, R Chandel ECS Journal of Solid State Science and Technology 12 (4), 041001 , 2023 2023 Citations: 1
Characterizing swirl strength and recirculation zone formation in tangentially injected isothermal flows R Sharma, M Kumar Journal of Applied Fluid Mechanics 16 (3), 549-560 , 2023 2023 Citations: 4
Effective Low Power ALU Design with Incorporation of MWCNTB On-chip Interconnects T Pathade, Y Agrawal, R Parekh, MG Kumar 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 371-377 , 2022 2022
Process variations in dielectric inserted side contact multilayer graphene nanoribbon interconnects using montecarlo simulations MG Kumar, Y Agrawal, VR Kumar 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 252-255 , 2022 2022 Citations: 2
A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects MG Kumar, Y Agrawal, VR Kumar, R Chandel Microelectronics Journal 118, 105294 , 2021 2021 Citations: 11
Impact of temperature on structure deformation for monolithic inter-tier vias in monolithic 3D IC packaging system G Deepthi, MG Kumar, M Tatineni ECS Journal of Solid State Science and Technology 10 (11), 111002 , 2021 2021 Citations: 5
CNTFET Based Low Power Repeaters for On-Chip Interconnect System T Pathade, Y Agrawal, R Parekh, MG Kumar 2021 25th International Symposium on VLSI Design and Test (VDAT), 1-4 , 2021 2021 Citations: 2
Structure fortification of mixed CNT bundle interconnects for nano integrated circuits using constraint-based particle swarm optimization T Pathade, Y Agrawal, R Parekh, MG Kumar IEEE Transactions on Nanotechnology 20, 194-204 , 2021 2021 Citations: 33
MOST CITED SCHOLAR PUBLICATIONS
A novel unified model for copper and MLGNR interconnects using voltage-and current-mode signaling schemes Y Agrawal, MG Kumar, R Chandel IEEE transactions on electromagnetic compatibility 59 (1), 217-227 , 2016 2016 Citations: 62
Comprehensive model for high-speed current-mode signaling in next generation MWCNT bundle interconnect using FDTD technique Y Agrawal, MG Kumar, R Chandel IEEE Transactions on Nanotechnology 15 (4), 590-598 , 2016 2016 Citations: 51
An efficient crosstalk model for coupled multiwalled carbon nanotube interconnects MG Kumar, R Chandel, Y Agrawal IEEE Transactions on Electromagnetic Compatibility 60 (2), 487-496 , 2017 2017 Citations: 36
Carbon nanotube interconnects− a promising solution for VLSI circuits MG Kumar, Y Agrawal, R Chandel IETE Journal of Education 57 (2), 46-64 , 2016 2016 Citations: 35
Structure fortification of mixed CNT bundle interconnects for nano integrated circuits using constraint-based particle swarm optimization T Pathade, Y Agrawal, R Parekh, MG Kumar IEEE Transactions on Nanotechnology 20, 194-204 , 2021 2021 Citations: 33
Modelling and performance analysis of dielectric inserted side contact multilayer graphene nanoribbon interconnects GK Mekala, Y Agrawal, R Chandel IET Circuits, Devices & Systems 11 (3), 232-240 , 2017 2017 Citations: 31
A unified delay, power and crosstalk model for current mode signaling multiwall carbon nanotube interconnects Y Agrawal, MG Kumar, R Chandel Circuits, Systems, and Signal Processing 37 (4), 1359-1382 , 2018 2018 Citations: 14
An efficient and novel FDTD method based performance investigation in high-speed current-mode signaling SWCNT bundle interconnect Y Agrawal, M Girish, R Chandel Sādhanā 43 (11), 175 , 2018 2018 Citations: 12
A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects MG Kumar, Y Agrawal, VR Kumar, R Chandel Microelectronics Journal 118, 105294 , 2021 2021 Citations: 11
Krill Herd Algorithm for solution of economic dispatch with valve-point loading effect H Pulluri, N Goutham Kumar, U Mohan Rao, Preeti, MG Kumar Applications of Computing, Automation and Wireless Systems in Electrical … , 2019 2019 Citations: 9
Timing and stability analysis of carbon nanotube interconnects MG Kumar, R Chandel, Y Agrawal 2015 IEEE International Symposium on Nanoelectronic and Information Systems … , 2015 2015 Citations: 8
Climate-smart water technologies for sustainable agriculture: A review. J. Water Climate Change 11 (4): 1455-1466 GT Patle, M Kumar, M Khanna 2019 Citations: 7
Modelling of reference evapotranspiration using neural network and regression approaches for semi-humid region of Sikkim GT Patle, BP Mandal, M Kumar, D Jhajharia Journal of Agricultural Engineering 60 (2), 205-217 , 2023 2023 Citations: 6
Neural network-based fast and intelligent signal integrity assessment model for emerging MWCNT bundle on-chip interconnects in integrated circuit G Bhatti, T Pathade, Y Agrawal, V Palaparthy, B Gohel, R Parekh, ... IETE Journal of Research 70 (3), 2878-2893 , 2024 2024 Citations: 5
Impact of temperature on structure deformation for monolithic inter-tier vias in monolithic 3D IC packaging system G Deepthi, MG Kumar, M Tatineni ECS Journal of Solid State Science and Technology 10 (11), 111002 , 2021 2021 Citations: 5
Characterizing swirl strength and recirculation zone formation in tangentially injected isothermal flows R Sharma, M Kumar Journal of Applied Fluid Mechanics 16 (3), 549-560 , 2023 2023 Citations: 4
Variability analysis of on-chip graphene interconnects at subthreshold regime N Patel, Y Agrawal, R Parekh, MG Kumar 2020 IEEE International Students' Conference on Electrical, Electronics and … , 2020 2020 Citations: 4
Performance analysis of mixed-wall CNT interconnects using colliding bodies optimization technique GK Mekala, Y Agrawal, R Chandel, A Kumar Major Applications of Carbon Nanotube Field-Effect Transistors (CNTFET), 189-211 , 2020 2020 Citations: 4
Performance analysis of multilayer graphene nano-ribbon in current-mode signaling interconnect system Y Agrawal, R Chandel, MG Kumar 2015 IEEE International Symposium on Nanoelectronic and Information Systems … , 2015 2015 Citations: 4
Pushpanjali; Subbarao, AVM; Singh, VK; Srivastava, A. Generalization Ability of Bagging and Boosting Type Deep Learning Models in Evapotranspiration Estimation. Water 2024, 16 … M Kumar, Y Agrawal, S Adamala 2024 Citations: 3
