Power electronics packaging
Thermal characterization
149
Scopus Publications
Scopus Publications
Enhanced Electrical Performance Assessment and Thermal Characterization of a High Voltage 3D Power Module based on Modular and Demountable Assembly with Direct Dielectric Liquid Cooling Omar Sanjakdar, Yvan Avenas, Rachelle Hanna, Guillaume Piquet Boisson, Emmanuel Marcault, Antoine Philippe IEEE Transactions on Industry Applications, 2026 In this paper, a novel 3D power module structure based on direct dielectric liquid cooling is proposed for high voltage applications. This structure allows modular assembly and puts an end to the ever-existing compromise between high electrical insulation and high thermal performance, which usually requires a trade-off in the thickness of the ceramic layer. First, the proposed power module, its demountable assembly, and the associated fabrication methodology are described. The module is then evaluated through electromagnetic and transient electric field simulations, using Ansys Q3D Extractor and Comsol®Multiphysics respectively. Stray inductance measurements are carried out using a precision impedance analyzer. In addition, direct current (DC) breakdown voltage measurements are conducted on the dielectric liquid alone and on the structure, submerged in the liquid, in order to evaluate its voltage withstand capability. The dynamic performance of the switching cell, under the proposed packaging, is evaluated through a double pulse test (DPT). Finally, an experimental thermal characterization is carried out to determine the packaging thermal resistance under the proposed liquid cooling approach, followed by a comparison with conventional high-voltage power modules.
Electrical Characterization of Modular 3D Packaging Assembled With Removable Metal Parts Paul Bruyere, Alexis Derbey, Betina Zynger-Capaverde, Eric Vagnon, Jean-Luc Schanen, Jean-Michel Guichon, Omar Sanjakdar, Yvan Avenas IEEE Transactions on Industry Applications, 2026 This paper proposes a novel modular packaging concept based on the 3D integration of 1.2 kV SiC MOSFET with metal foams for electrical contacts with pressure assembly. The latter make possible the disassembly of switching cells by keeping low electrical resistance and inductance inside the package. Thus, static and dynamic experimental characterizations are carried out to evaluate their impact compared to copper interposers. Static measurements show that the electrical resistance of the package is in the range from 3 to 4 mΩ. Dynamic characterizations demonstrate that the stray inductance of the switching cell is close to 3 nH. With results obtained with copper interposers close to the ones obtained with foams, the material used for the electrical interconnection have low impact on the electrical performances of the power module. However, the modification of the pressure distribution in the power module induces a modification of the resistance and stray inductance. This dependency is more important for copper interposers because they are non-deformable.
Technology-Dependent Parametric Manufacturing Life Cycle Inventory for Power Module Fatimata-Fatimata Diarrassouba, Yvan Avenas, Jean-Christophe Crébier 2025 Energy Conversion Congress and Expo Europe Ecce Europe 2025 Proceedings, 2025 The life cycle of a power module, a device that primarily functions as a high-frequency switch for electrical quantities (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$I$</tex> and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$V$</tex>), has a considerable environmental impact. This is due to the extraction of materials, manufacturing processes with their inputs and outputs (emissions, waste), use phase, and end-of-life, which is still poorly managed. Conducting a Life Cycle Assessment (LCA) is an excellent starting point. However, the results of LCAs do not always facilitate effective mitigation due to the challenges associated with interpreting the results, choosing which environmental indicator to prioritize, and also because the product is already ready-made. To address this, our goal is to integrate LCA earlier in the power converter conception phase by providing electronic engineers with a tool that helps them understand environmental impacts, assess their designs, compare different options, and optimize their choices. This paper is to support the creation of a comprehensive Parametric Life Cycle Inventory (PLCI) for the manufacturing phase of power modules. The model is independent of semiconductor technology and considers both materials and processes. The method is presented here, and the inventory model is made fully available to support the LCA of power modules within power converters.
Electrical Characterization of Solderless Interconnections Dedicated to Pressure Assembly Power Modules Paul Bruyere, Eric Vagnon, Yvan Avenas Proceedings of the IEEE International Workshop on Integrated Power Packaging Iwipp, 2025 This paper presents the electrical characterization of solderless interconnection for the development of modular power modules with pressure assembly thanks to soft materials like metallic foams. This type of material can be used to connect two Printed Circuit Boards (PCB), and allows disassembling and changing the PCB if necessary. Electrical resistances of these soft materials are measured as a function of pressure and compared to classical interconnections like copper plates. With differences higher than 70% compared to copper plates, soft materials seem interesting for low resistance packaging interconnections.
Online Monitoring for Aging Detection and Remaining Useful Life Estimation of IGBTs, Considering Main Aging Mechanisms Ramin Qaedi, Ebrahim Farjah, Teymoor Ghanbari, Abbas Mehraban, Yvan Avenas 2025 16th Power Electronics Drive Systems and Technologies Conference Pedstc 2025, 2025 Online aging monitoring for power converters is an intricate problem due to various aging mechanisms in their components. Among the converters’ components, online aging monitoring of the switches and prediction of their remaining useful life (RUL) are crucial. In this paper, an online aging monitoring approach is presented for IGBTs based on changes in their on-state resistance (Ron), taking into consideration main aging mechanisms, including solder aging, bond wire aging, and mixed aging. A reference model with the same parameters of the converter is run in real time for this purpose. The proposed approach is composed of three main stages. First, the suspected event is detected, when a considerable difference occurs between the estimated switch junction temperature from the measurement and reference model. In the second stage, Ron is calculated for each aging mechanism. Thanks to the predictable behavior of changing Ron during various aging mechanisms, the aging progress level can be determined precisely. Finally, using a Kalman Filter estimator, the RUL of the switch is estimated at each aging progress level. The proposed approach is evaluated by emulating the aging mechanisms on the switch of a boost chopper in different experiments.
Electrical Evaluation of a Modular High Voltage 3D Power Module using Direct Dielectric Liquid Cooling Omar Sanjakdar, Yvan Avenas, Rachelle Hanna, Guillaume Piquet Boisson, Emmanuel Marcault, Antoine Philippe Conference Proceedings IEEE Applied Power Electronics Conference and Exposition APEC, 2025 In this paper, a novel 3D power module structure based on direct dielectric liquid cooling is proposed for high voltage applications. This structure allows modular assembly and puts an end to the ever-existing compromise between high electrical insulation and high thermal performance, which usually requires a trade-off in the thickness of the ceramic layer. This proposed power module assembly is illustrated and then evaluated through electromagnetic and transient electric field simulations, using Ansys Q3D Extractor and Comsol®Multiphysics respectively. Stray inductance measurements are carried out using a precision impedance analyzer. Finally, direct current (DC) breakdown voltage measurements are conducted on the dielectric liquid alone and on the structure, submerged in the liquid, in order to evaluate its voltage withstand capability.
Electrical Characterization of Modular 3D Packaging Assembled with Compressed Metal Foams Paul Bruyere, Alexis Derbey, Betina Zynger-Capaverde, Yvan Avenas, Eric Vagnon, Jean-Luc Schanen, Jean-Michel Guichon, Omar Sanjakdar Conference Proceedings IEEE Applied Power Electronics Conference and Exposition APEC, 2025 This paper proposes a novel modular packaging concept based on the 3D integration of 1.2kV SiC MOSFET with metal foams for electrical contacts with pressure assembly. These foams could allow improving the disassembly of switching cells by keeping low electrical resistance and inductance inside the package. Thus, static and dynamic experimental characterizations are carried out to evaluate their impact compared to a massive interconnection represented by copper interposers. Static measurements show that the electrical resistance of the package is 2.3mΩ which represents 7% of the total resistance. Dynamic characterizations demonstrate that the stray inductance of the switching cell is equal to 2.7nH. With results of the massive interconnection close to the ones of foams, the material used for the electrical interconnection have no impact on the electrical performances of the power module. The modification of pressure assembly of the power module shows however a global increase of the packaging resistance and stray inductance of the power module for both solutions. This increase is more important for the massive interconnection due the non-deformable mechanicals properties.
Power Devices Sandwiched Between Silver-Diamond Parts for High Performance Module R. Khazaka, A. Casado Ramoneda, Y. Avenas, T. Youssef, C. Gautier, S. Azzopardi, T. Murakami, M. Tamaru 2025 International Conference on Electronics Packaging and Imaps all Asia Conference Icep Iaac 2025, 2025 Devices sandwiched between high thermal conductivity Silver Diamond (AgD) clip and spreader can be an effective, simple and reliable solution to significantly reduce the package thermal resistance. The thermal performance of such package is compared to conventional wire bonded devices for assemblies with and without baseplate. Results show that global thermal resistance improvement varies between 30% and 48% for power module without baseplate and between 25% and 42% when a baseplate is used. Using the same solution with Cu clip and spreader, the ratio of improvement does not exceed 32% in the best case. Moreover, the coefficient of thermal expansion mismatch between AgD and power device is low. Hence, AgD clip and spreader allow reducing the maximum Von-Mises stresses in the solder by at least 63% compared to copper ones.
Analysis of Power Modules Including Phase Change Materials in the Top Interconnection of Semiconductor Devices Rabih Khazaka, Rachelle Hanna, Yvan Avenas, Stéphane Azzopardi Electronic Materials, 2024 Power modules can occasionally be exposed to brief power peaks, causing overheating and premature failure of the power semiconductor devices. In order to overcome this issue without oversizing the module or its cooling system, this study aims to design a new class of power modules with integrated Phase Change Material (PCM) in a container serving as a top device interconnection. Simulations and experiments are performed with two organic PCMs, and the interest in adding copper foam is discussed. Under various test conditions, the results show that the simulations agree well with the experiments. Hence, virtual prototyping can be very useful for sizing containers based on a specific mission profile. For a constant selected PCM volume (around 1 cm3/device) and with a convection heat transfer coefficient value of 800 W.m−2.K−1, the solution allows achieving a junction temperature reduction of about 35 °C (erythritol and 90% porosity copper foam) compared to a wire-bonded conventional technique. Repetitive power cycles can be achieved with both materials, but the selection of the PCM should be conducted cautiously based on the mission profile. The two selected organic PCMs show degradation of their latent heat of fusion and mass loss during high-temperature isothermal aging in air above 130 °C. By assuming as endpoint criterion the reduction of energy storage by 50% compared to the initial state, the lifetime of erythritol and RT100 is evaluated to be about 100 and 340 h, respectively, during aging at 150 °C.
Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power Electronics ETG Fachbericht, 2024
Fabrication and characterization of low value embedded resistors for use in PCB embedded RC snubber for more integrated converter ETG Fachbericht, 2024
Test bench for the characterization of two-phase passive immersion cooling of power electronic devices ETG Fachbericht, 2024
Interest of high frequency decoupling inductors for reducing common mode current in high speed switching cells ETG Fachbericht, 2024
Fabrication Of Copper Heat Sinks For Power Electronics By Composite Extrusion Additive Manufacturing And Sintering World Pm 2022 Congress Proceedings, 2022
Implementation and validation of a dynamic calorimetric method to evaluate the losses in switching discrete power MOSFETs Cips 2020 11th International Conference on Integrated Power Electronics Systems, 2020
Generic thermal cooling design for multicell converters Cips 2020 11th International Conference on Integrated Power Electronics Systems, 2020
Thermal analysis of power module with double sided direct cooling using ceramic heat sinks Cips 2020 11th International Conference on Integrated Power Electronics Systems, 2020
Sintering Behaviour of Silver Paste for Assembly of Power Electronics Components Proceedings Euro Pm2020 Congress and Exhibition, 2020
Low voltage switching cell for high density and modular 3D power module with integrated air-cooling Cips 2020 11th International Conference on Integrated Power Electronics Systems, 2020
Experimental evaluation of IGBT junction temperature measurement via a modified-VCE (ΔVCE_ΔVGE) method with series resistance removal Cips 2016 9th International Conference on Integrated Power Electronics Systems, 2019
In-situ condition monitoring system to study the ageing of power semiconductor devices in photovoltaic inverters Cips 2018 10th International Conference on Integrated Power Electronics Systems, 2018
Identifying the stray elements of the experimental setup used in the semiconductor datasheets Cips 2018 10th International Conference on Integrated Power Electronics Systems, 2018
Analytical Losses Model for SiC semiconductors dedicated to optimization operations Pcim Europe 2016 International Exhibition and Conference for Power Electronics Intelligent Motion Renewable Energy and Energy Management, 2016
Fault tolerant 24 KVA interleaved inverter Pierre-Olivier Jeannin, David Frey, Yvan Avenas, Kevin Guepratte, Herve Stephan 2012 IEEE Energy Conversion Congress and Exposition Ecce 2012, 2012
Numerical study of a liquid metal mini-channel cooler for power semiconductor devices 17th International Workshop on Thermal Investigations of Ics and Systems Therminic 2011, 2011
Modeling of power devices with drift region integrated microchannel cooler 17th International Workshop on Thermal Investigations of Ics and Systems Therminic 2011, 2011
A new methodology for early stage thermal analysis of complex electronic systems 15th International Workshop on Thermal Investigations of Ics and Systems Therminic 2009, 2009
A new methodology for multi-level thermal characterization of complex electronic systems: From die to board level 2009 European Microelectronics and Packaging Conference Empc 2009, 2009
DBC technology for extremely thin flat heat pipes L. Kamenova, Y. Avenas, Chr. Schaeffer, S. Tzanova, G. Kapelski, J. Schulz-Harder Conference Record IAS Annual Meeting IEEE Industry Applications Society, 2007
DBC (Direct Bonded Copper) substrate with integrated flat heat pipe 15th European Microelectronics and Packaging Conference and Exhibition Empc 2005 Conference Programme and Proceedings, 2005
Analytical investigation of flat silicon micro heat spreaders Conference Record IAS Annual Meeting IEEE Industry Applications Society, 2004
Experimental study of a flat silicon heat pipe with microcapillary grooves Thermomechanical Phenomena in Electronic Systems Proceedings of the Intersociety Conference, 2004
Thermal characterization of flat silicon heat pipes Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2004
Realization and thermal analysis of silicon thermal spreaders used in power electronics cooling Proceedings of the IEEE International Conference on Industrial Technology, 2003
Silicon heat pipes used as thermal spreaders C. Gillot, Y. Avenas, N. Cezac, G. Poupon, C. Schaeffer, E. Fournier IEEE Transactions on Components and Packaging Technologies, 2003
Thermal analysis of thermal spreaders used in power electronics cooling Conference Record IAS Annual Meeting IEEE Industry Applications Society, 2002
Silicon heat pipes used as thermal spreaders C. Gillot, Y. Avenas, N. Cezac, G. Poupon, C. Schaeffer, E. Fournier Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Itherm, 2002
Silicon heat pipes used as thermal spreaders Thermomechanical Phenomena in Electronic Systems Proceedings of the Intersociety Conference, 2002
