Mechanical behavior of materials
Reliability
Electromigration
3242
Scholar Citations
31
Scholar h-index
99
Scholar i10-index
RECENT SCHOLAR PUBLICATIONS
Strength-ductility synergy in lightweight aluminium alloys with nano-layered fibres and core-shell nano-particles H Kumar, P Kumar, D Raabe, B Gault, SK Makineni Nature Communications , 2026 2026
Controlling Mixed-Mode Electromagnetic Fracture to Create Patterned Cuts into Metallic Foils: Fundamentals and Instrumentation S Telpande, I Dutta, P Kumar Review of Scientific Instruments , 2026 2026
Exploiting solute segregation and partitioning to the deformation-induced planar defects and nano-martensite in designing ultra-strong Co-Ni base alloys A Godha, K Sundar, MP Singh, SK Mishra, P Kumar, B Govind, ... Materials Science and Engineering: A , 2026 2026
Quantitative Characterization of Localized Creep Deformation and Failure in Grade 91 Weldments by Digital Image Correlation‐Augmented Experimentation N Suman, JG Kumar, GVP Reddy, V Jayaram, P Kumar Advanced Engineering Materials, e202503194 , 2026 2026
Preface: Special issue honoring the legacy of Professor Michael E. Kassner P Kumar, MT Pérez-Prado, TG Langdon Journal of Materials Science 60 (39), 18153-18156 , 2025 2025
Proportional-stress points in cantilevers: Identification and application to high throughput extraction of plastic flow parameters P Goel, V Jayaram, P Kumar Journal of Materials Science 60 (39), 18393-18413 , 2025 2025 Citations: 1
Exploiting solute segregation and partitioning to the deformation-induced planar defects and nano-martensite in designing ultra-strong Co-Ni base alloys A Godha, MP Singh, K Sundar, SK Mishra, P Kumar, SK Makineni arXiv preprint arXiv:2507.22078 , 2025 2025
Interfacially ordered phase states enable high-strength ductile eutectic Al alloys H Kumar, P Kumar, D Raabe, B Gault, SK Makineni arXiv preprint arXiv:2507.08327 , 2025 2025
Creep-fatigue damage evolution in a nickel-based superalloy: An experiment-inspired modeling approach for life prediction C Kumar, P Kumar International Journal of Fatigue 195, 108872 , 2025 2025 Citations: 12
Role of Cavitation in Necking-Driven Tertiary Stage of Power-Law Creep of Sn and Sn-Ag-Cu Solder Alloy: An Experiment-Inspired Modeling Approach A Kanjilal, P Kumar Journal of Electronic Materials 54 (4), 2638-2656 , 2025 2025 Citations: 3
Electric current-induced solid-state crack healing and life extension S Telpande, C Kumar, D Sharma, P Kumar Acta Materialia 283, 120573 , 2025 2025 Citations: 19
A comparative study of the wrought and EBAM alloys under static and fatigue loading AV Eremin, SV Panin, MV Burkov, AA Bogdanov, P Kumar, S R Russian Physics Journal , 2025 2025
Experimental and theoretical determination of the Grüneisen parameter to analyze the density effect on anharmonicity and thermal conductivity in the NbCoSb system I Kumar, J Peter, A Gawande, G Venkatesan, P Kumar, S Suwas, ... Physical Chemistry Chemical Physics 27 (46), 24872-24887 , 2025 2025
Microstructure optimization for improving creep resistance of additively manufactured Ni-based superalloy IN939 through heat treatment C Kumar, S Reddy, NK Eswaramoorthy, P Ravanappa, V Chintapenta, ... Journal of Materials Science 60 (3), 1545-1560 , 2025 2025 Citations: 11
Material volume reduction for creep testing using composite cantilevers and its application for residual life assessment F Hijazi, AHV Pavan, V Jayaram, P Kumar Materials Science and Engineering: A 918, 147440 , 2024 2024 Citations: 4
High-throughput estimation of transient creep response of a Ti6Al alloy using bending P Goel, A Pramanik, V Jayaram, D Banerjee, P Kumar Journal of Materials Research, 1-13 , 2024 2024 Citations: 2
Synergistic effects of Pt and Y addition in (Ni, Pt) CrAlY bond coat on oxide spallation resistance and growth of interdiffusion zone between bond coat and Ni-based single … U Bansal, N Esakkiraja, T Baskaran, T Paul, R Ravi, P Kumar, V Jayaram, ... Corrosion Science 240, 112485 , 2024 2024 Citations: 6
Role of threshold stress in creep of IN740H, a γ′-lean Ni-based superalloy C Kumar, AHV Pavan, SK Makineni, P Kumar Materials Science and Engineering: A 903, 146667 , 2024 2024 Citations: 10
Semiconductor Nanoparticle Anchored Single-Walled Carbon Nanotubes for a Bolometer K VP, A Das Mahapatra, V Panwar, A Mondal, C Kumar, P Kumar, A Misra Langmuir 40 (21), 11023-11029 , 2024 2024 Citations: 4
Preface to the special issue: Processing bulk nanostructured materials M Kawasaki, P Kumar Journal of Materials Science 59 (14), 5647-5650 , 2024 2024 Citations: 2
MOST CITED SCHOLAR PUBLICATIONS
Review: overcoming the paradox of strength and ductility in ultrafine-grained materials at low temperatures P Kumar, M Kawasaki, TG Langdon J Mater Sci 51 (1), 7-18 , 2016 2016 Citations: 139
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties I Dutta, P Kumar, G Subbarayan JOM Journal of the Minerals, Metals and Materials Society 61 (6), 29-38 , 2009 2009 Citations: 133
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV) P Kumar, I Dutta, MS Bakir Journal of electronic materials 41 (2), 322-335 , 2012 2012 Citations: 123
Harper-Dorn creep ME Kassner, P Kumar, W Blum International journal of plasticity 23 (6), 980-1000 , 2007 2007 Citations: 108
Mechanical characteristics of a Zn–22% Al alloy processed to very high strains by ECAP P Kumar, C Xu, TG Langdon Materials Science and Engineering: A 429 (1-2), 324-328 , 2006 2006 Citations: 82
Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 … , 2011 2011 Citations: 70
Nano‐and Micro‐Mechanical Properties of Ultrafine‐Grained Materials Processed by Severe Plastic Deformation Techniques M Kawasaki, B Ahn, P Kumar, J Jang, TG Langdon Advanced Engineering Materials , 2017 2017 Citations: 67
Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Journal of Alloys and Compounds 727, 832-840 , 2017 2017 Citations: 60
Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Acta Materialia 131, 260-270 , 2017 2017 Citations: 59
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu, M Renavikar, R Mahajan Journal of Electronic Materials, 1-15 , 2011 2011 Citations: 58
The significance of grain boundary sliding in the superplastic Zn–22% Al alloy after processing by ECAP P Kumar, C Xu, TG Langdon Materials Science and Engineering: A 410, 447-450 , 2005 2005 Citations: 57
Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias I Dutta, P Kumar, MS Bakir JOM Journal of the Minerals, Metals and Materials Society 63 (10), 70-77 , 2011 2011 Citations: 55
Fifty years of Harper–Dorn creep: a viable creep mechanism or a Californian artifact? P Kumar, ME Kassner, TG Langdon Journal of materials science 42 (2), 409-420 , 2007 2007 Citations: 55
Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications I Dutta, R Raj, P Kumar, T Chen, CM Nagaraj, J Liu, M Renavikar, ... Journal of electronic materials 38 (12), 2735-2745 , 2009 2009 Citations: 52
The contribution of grain boundary sliding in tensile deformation of an ultrafine-grained aluminum alloy having high strength and high ductility T Mungole, P Kumar, M Kawasaki, TG Langdon Journal of Materials Science 50 (10), 3549-3561 , 2015 2015 Citations: 51
Recrystallization and Ag₃Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys U Sahaym, B Talebanpour, S Seekins, I Dutta, P Kumar, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology 3 … , 2013 2013 Citations: 50
Electromigration in Metallic Materials and Its Role in Whiskering P Kumar Handbook of Solid State Diffusion, Volume 2, 173-206 , 2017 2017 Citations: 49
A critical examination of the paradox of strength and ductility in ultrafine-grained metals T Mungole, P Kumar, M Kawasaki, TG Langdon Journal of Materials Research 29 (21), 2534-2546 , 2014 2014 Citations: 47
Electric current induced flow of liquid metals: Mechanism and substrate-surface effects P Kumar, J Howarth, I Dutta Journal of Applied Physics 115, 044915 , 2014 2014 Citations: 47
Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system V Baheti, S Islam, P Kumar, R Ravi, R Narayanan, D Hongqun, ... Philosophical Magazine 96 (1), 15-30 , 2016 2016 Citations: 42
