avenas

Recent Scopus Publications

1. Enhanced Electrical Performance Assessment and Thermal Characterization of a High Voltage 3D Power Module based on Modular and Demountable Assembly with Direct Dielectric Liquid Cooling
   IEEE Transactions on Industry Applications, 2026
2. Electrical Characterization of Modular 3D Packaging Assembled With Removable Metal Parts
   IEEE Transactions on Industry Applications, 2026
3. Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition
   Microelectronics Reliability, 2025
4. Technology-Dependent Parametric Manufacturing Life Cycle Inventory for Power Module
   2025 Energy Conversion Congress and Expo Europe Ecce Europe 2025 Proceedings, 2025
5. Electrical Characterization of Solderless Interconnections Dedicated to Pressure Assembly Power Modules
   Proceedings of the IEEE International Workshop on Integrated Power Packaging Iwipp, 2025

Links

• ORCID https://orcid.org/0000-0002-6079-8582
• Scopus https://www.scopus.com/authid/detail.uri?authorId=6603315522